Invention Grant
- Patent Title: Integrated circuit packaging system with package on package support and method of manufacture thereof
- Patent Title (中): 具有封装支持的集成电路封装系统及其制造方法
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Application No.: US13162526Application Date: 2011-06-16
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Publication No.: US08530277B2Publication Date: 2013-09-10
- Inventor: ChanHoon Ko , SangJin Lee
- Applicant: ChanHoon Ko , SangJin Lee
- Applicant Address: SG Singapore
- Assignee: STATS ChipPAC Ltd.
- Current Assignee: STATS ChipPAC Ltd.
- Current Assignee Address: SG Singapore
- Agency: Ishimaru & Associates LLP
- Agent I-Chang John Yang
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A method of manufacture of an integrated packaging system includes: providing a substrate; mounting a die over the substrate; mounting an interposer having a slot over the die; covering a first encapsulant over the die and the interposer, a central region of the interposer exposed from the first encapsulant; and forming a hole through the first encapsulant to expose a peripheral portion of the interposer.
Public/Granted literature
- US20120319284A1 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE ON PACKAGE SUPPORT AND METHOD OF MANUFACTURE THEREOF Public/Granted day:2012-12-20
Information query
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