Invention Grant
- Patent Title: Method for manufacturing semiconductor device
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Application No.: US12976388Application Date: 2010-12-22
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Publication No.: US08530285B2Publication Date: 2013-09-10
- Inventor: Shunpei Yamazaki , Takuya Hirohashi , Masahiro Takahashi , Takashi Shimazu
- Applicant: Shunpei Yamazaki , Takuya Hirohashi , Masahiro Takahashi , Takashi Shimazu
- Applicant Address: JP Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
- Agency: Robinson Intellectual Property Law Office, P.C.
- Agent Eric J. Robinson
- Priority: JP2009-296825 20091228
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/336 ; H01L27/108

Abstract:
A larger substrate can be used, and a transistor having a desirably high field-effect mobility can be manufactured through formation of an oxide semiconductor layer having a high degree of crystallinity, whereby a large-sized display device, a high-performance semiconductor device, or the like can be put into practical use. A first multi-component oxide semiconductor layer is formed over a substrate and a single-component oxide semiconductor layer is formed thereover; then, crystal growth is carried out from a surface to an inside by performing heat treatment at 500° C. to 1000° C. inclusive, preferably 550° C. to 750° C. inclusive so that a first multi-component oxide semiconductor layer including single crystal regions and a single-component oxide semiconductor layer including single crystal regions are formed; and a second multi-component oxide semiconductor layer including single crystal regions is stacked over the single-component oxide semiconductor layer including single crystal regions.
Public/Granted literature
- US20110156026A1 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2011-06-30
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