Invention Grant
- Patent Title: Semiconductor device and manufacturing method thereof
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US12721298Application Date: 2010-03-10
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Publication No.: US08530333B2Publication Date: 2013-09-10
- Inventor: Atsuo Isobe , Hiromichi Godo , Satoshi Shinohara
- Applicant: Atsuo Isobe , Hiromichi Godo , Satoshi Shinohara
- Applicant Address: JP Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
- Agency: Fish & Richardson P.C.
- Priority: JP2009-059157 20090312
- Main IPC: H01L21/46
- IPC: H01L21/46

Abstract:
An object is to provide a semiconductor device which solves a problem that can occur when a substrate having an insulating surface is used. The semiconductor device includes a base substrate having an insulating surface; a conductive layer over the insulating surface; an insulating layer over the conductive layer; a semiconductor layer having a channel formation region, a first impurity region, a second impurity region, and a third impurity region provided between the channel formation region and the second impurity region over the insulating layer; a gate insulating layer configured to cover the semiconductor layer; a gate electrode over the gate insulating layer; a first electrode electrically connected to the first impurity region; and a second electrode electrically connected to the second impurity region. The conductive layer is held at a given potential.
Public/Granted literature
- US20100230754A1 Semiconductor Device and Manufacturing Method Thereof Public/Granted day:2010-09-16
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