Invention Grant
- Patent Title: Epitaxial semiconductor deposition methods and structures
- Patent Title (中): 外延半导体沉积方法和结构
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Application No.: US12556377Application Date: 2009-09-09
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Publication No.: US08530340B2Publication Date: 2013-09-10
- Inventor: Paul D. Brabant , Joseph P. Italiano , Chantal J. Arena , Pierre Tomasini , Ivo Raaijmakers , Matthias Bauer
- Applicant: Paul D. Brabant , Joseph P. Italiano , Chantal J. Arena , Pierre Tomasini , Ivo Raaijmakers , Matthias Bauer
- Applicant Address: US AZ Phoenix
- Assignee: ASM America, Inc.
- Current Assignee: ASM America, Inc.
- Current Assignee Address: US AZ Phoenix
- Agency: Knobbe, Martens, Olson & Bear LLP
- Main IPC: H01L21/20
- IPC: H01L21/20

Abstract:
Methods for depositing epitaxial films such as epitaxial Ge and SiGe films. During cooling from high temperature processing to lower deposition temperatures for Ge-containing layers, Si or Ge compounds are provided to the substrate. Smooth, thin, relatively defect-free Ge or SiGe layers result. Retrograded relaxed SiGe is also provided between a relaxed, high Ge-content seed layer and an overlying strained layer.
Public/Granted literature
- US20100006024A1 EPITAXIAL SEMICONDUCTOR DEPOSITION METHODS AND STRUCTURES Public/Granted day:2010-01-14
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