Invention Grant
US08530559B2 Composite of organic compound and copper nanoparticles, composite of organic compound and copper(I) oxide nanoparticles, and methods for producing the composites
有权
有机化合物和铜纳米颗粒的复合物,有机化合物和氧化铜(I)纳米粒子的复合材料,以及复合材料的制备方法
- Patent Title: Composite of organic compound and copper nanoparticles, composite of organic compound and copper(I) oxide nanoparticles, and methods for producing the composites
- Patent Title (中): 有机化合物和铜纳米颗粒的复合物,有机化合物和氧化铜(I)纳米粒子的复合材料,以及复合材料的制备方法
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Application No.: US13634344Application Date: 2011-02-28
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Publication No.: US08530559B2Publication Date: 2013-09-10
- Inventor: Yoshiyuki Sano , Ren-Hua Jin , Kaori Kawamura , Masafumi Uota
- Applicant: Yoshiyuki Sano , Ren-Hua Jin , Kaori Kawamura , Masafumi Uota
- Applicant Address: JP Tokyo
- Assignee: DIC Corporation
- Current Assignee: DIC Corporation
- Current Assignee Address: JP Tokyo
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2010-067853 20100324
- International Application: PCT/JP2011/054454 WO 20110228
- International Announcement: WO2011/118339 WO 20110929
- Main IPC: C08K3/10
- IPC: C08K3/10

Abstract:
Provided is a composite including copper nanoparticles or copper(I) oxide nanoparticles and a thioether-containing organic compound represented by X(OCH2CHR1)nOCH2CH(OH)CH2SZ [X represents an alkyl group; R1 represents a hydrogen atom or a methyl group; n represents an integer of 2 to 100; R1 is independent between repeating units and may be the same or different; and Z represents an alkyl group, an allyl group, an aryl group, an arylalkyl group, —R2—OH, —R2—NHR3, or —R2—(COR4)m (where R2 represents a saturated hydrocarbon group; R3 represents a hydrogen atom, an acyl group, an alkoxycarbonyl group, or a benzyloxycarbonyl group; R4 represents a hydroxy group, an alkyl group, or an alkoxy group; and m represents 1 to 3)]. Provided is a method for producing a composite of an organic compound and copper nanoparticles or a composite of an organic compound and copper(I) oxide nanoparticles, the method including reducing a copper compound in the presence of a thioether-containing organic compound represented by the general formula (1) above.
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