Invention Grant
- Patent Title: Print processing for patterned conductor, semiconductor and dielectric materials
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Application No.: US12114741Application Date: 2008-05-02
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Publication No.: US08530589B2Publication Date: 2013-09-10
- Inventor: Erik Scher , Steven Molesa , Joerg Rockenberger , Arvind Kamath , Ikuo Mori
- Applicant: Erik Scher , Steven Molesa , Joerg Rockenberger , Arvind Kamath , Ikuo Mori
- Applicant Address: US CA San Jose
- Assignee: Kovio, Inc.
- Current Assignee: Kovio, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Murabito, Hao & Barnes LLP
- Agent Andrew D. Fortney
- Main IPC: H01L29/16
- IPC: H01L29/16 ; C08J3/28 ; C08F2/42

Abstract:
Embodiments relate to printing features from an ink containing a material precursor. In some embodiments, the material includes an electrically active material, such as a semiconductor, a metal, or a combination thereof. In another embodiment, the material includes a dielectric. The embodiments provide improved printing process conditions that allow for more precise control of the shape, profile and dimensions of a printed line or other feature. The composition(s) and/or method(s) improve control of pinning by increasing the viscosity and mass loading of components in the ink. An exemplary method thus includes printing an ink comprising a material precursor and a solvent in a pattern on the substrate; precipitating the precursor in the pattern to form a pinning line; substantially evaporating the solvent to form a feature of the material precursor defined by the pinning line; and converting the material precursor to the patterned material.
Public/Granted literature
- US20090065776A1 Print Processing for Patterned Conductor, Semiconductor and Dielectric Materials Public/Granted day:2009-03-12
Information query
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