Invention Grant
- Patent Title: Strain inducing semiconductor regions
- Patent Title (中): 应变诱导半导体区域
-
Application No.: US13160886Application Date: 2011-06-15
-
Publication No.: US08530884B2Publication Date: 2013-09-10
- Inventor: Suman Datta , Jack T. Kavalieros , Been-Yih Jin
- Applicant: Suman Datta , Jack T. Kavalieros , Been-Yih Jin
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L31/072

Abstract:
A method to form a strain-inducing semiconductor region is described. In one embodiment, formation of a strain-inducing semiconductor region laterally adjacent to a crystalline substrate results in a uniaxial strain imparted to the crystalline substrate, providing a strained crystalline substrate. In another embodiment, a semiconductor region with a crystalline lattice of one or more species of charge-neutral lattice-forming atoms imparts a strain to a crystalline substrate, wherein the lattice constant of the semiconductor region is different from that of the crystalline substrate, and wherein all species of charge-neutral lattice-forming atoms of the semiconductor region are contained in the crystalline substrate.
Public/Granted literature
- US20120061649A1 STRAIN-INDUCING SEMICONDUCTOR REGIONS Public/Granted day:2012-03-15
Information query
IPC分类: