Invention Grant
- Patent Title: Thinned semiconductor components having lasered features and method of fabrication
- Patent Title (中): 具有激光特征和制造方法的减薄半导体元件
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Application No.: US13473644Application Date: 2012-05-17
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Publication No.: US08530895B2Publication Date: 2013-09-10
- Inventor: Alan G. Wood , Tim Corbett
- Applicant: Alan G. Wood , Tim Corbett
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agent Stephen A. Gratton
- Main IPC: H01L29/04
- IPC: H01L29/04
Abstract:
A semiconductor component includes a thinned semiconductor substrate having a back side and a circuit side containing integrated circuits and associated circuitry. The semiconductor component also includes at least one lasered feature on the back side configured to provide selected electrical or physical characteristics for the substrate. The lasered feature can cover the entire back side or only selected areas of the back side, and can be configured to change electrical properties, mechanical properties or gettering properties of the substrate.
Public/Granted literature
- US20120241742A1 THINNED SEMICONDUCTOR COMPONENTS HAVING LASERED FEATURES AND METHOD OF FABRICATION Public/Granted day:2012-09-27
Information query
IPC分类:
