Invention Grant
- Patent Title: Power surface mount light emitting die package
- Patent Title (中): 功率表面贴装发光管芯封装
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Application No.: US13022365Application Date: 2011-02-07
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Publication No.: US08530915B2Publication Date: 2013-09-10
- Inventor: Peter Scott Andrews , Ban P. Loh
- Applicant: Peter Scott Andrews , Ban P. Loh
- Applicant Address: US NC Durham
- Assignee: Cree, Inc.
- Current Assignee: Cree, Inc.
- Current Assignee Address: US NC Durham
- Agency: Jenkins, Wilson, Taylor & Hunt, P.A.
- Main IPC: B32B5/12
- IPC: B32B5/12
Abstract:
A light emitting die package is provided which includes a metal substrate having a first surface and a first conductive lead on the first surface. The first conductive lead is insulated from the substrate by an insulating film. The first conductive lead forms a mounting pad for mounting a light emitting device. The package includes a metal lead electrically connected to the first conductive lead and extending away from the first surface.
Public/Granted literature
- US20110121345A1 POWER SURFACE MOUNT LIGHT EMITTING DIE PACKAGE Public/Granted day:2011-05-26
Information query
