Invention Grant
- Patent Title: Light emitting device package and lighting system including the same
- Patent Title (中): 发光装置封装和照明系统包括相同
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Application No.: US13037868Application Date: 2011-03-01
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Publication No.: US08530925B2Publication Date: 2013-09-10
- Inventor: Hye Young Kim
- Applicant: Hye Young Kim
- Applicant Address: KR Seoul
- Assignee: LG Innotek Co., Ltd.
- Current Assignee: LG Innotek Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: McKenna Long & Aldridge LLP
- Priority: KR10-2010-0020647 20100309
- Main IPC: H01L29/22
- IPC: H01L29/22 ; H01L33/00 ; H01L31/0203 ; H01L29/227

Abstract:
Provided are a light emitting device package and a lighting system including the same. The light emitting device package includes: a body, a plurality of electrode layers, a light emitting device, and a molding member. The body includes a plurality of pits. The electrode layers include first protrusions disposed in the pits, and second protrusions protruding in a direction opposite to the first protrusions. The light emitting device is disposed on at least one of the plurality of electrode layers. The molding member is disposed on the light emitting device.
Public/Granted literature
- US20110220926A1 LIGHT EMITTING DEVICE PACKAGE AND LIGHTING SYSTEM INCLUDING THE SAME Public/Granted day:2011-09-15
Information query
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