Invention Grant
US08530929B2 Melt-processable, injection-moldable thermoplastic polymer composition and semi-conductive devices fabricated therewith
有权
可熔融加工的可注射成型的热塑性聚合物组合物和用其制造的半导体器件
- Patent Title: Melt-processable, injection-moldable thermoplastic polymer composition and semi-conductive devices fabricated therewith
- Patent Title (中): 可熔融加工的可注射成型的热塑性聚合物组合物和用其制造的半导体器件
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Application No.: US13056683Application Date: 2009-07-31
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Publication No.: US08530929B2Publication Date: 2013-09-10
- Inventor: Weijun Zhou , Brian Chen , Patricia Ansems , Stephen F. Hahn
- Applicant: Weijun Zhou , Brian Chen , Patricia Ansems , Stephen F. Hahn
- Applicant Address: US MI Midland
- Assignee: Dow Global Technologies, LLC
- Current Assignee: Dow Global Technologies, LLC
- Current Assignee Address: US MI Midland
- Agency: Muncy, Geissler, Olds & Lowe, PLLC
- International Application: PCT/US2009/052340 WO 20090731
- International Announcement: WO2010/025004 WO 20100304
- Main IPC: H01L33/56
- IPC: H01L33/56 ; C08G63/91
Abstract:
A thermoplastic, hydrogenated vinyl aromatic/conjugated diene block polymer composition, especially a hydrogenated styrene/butadiene triblock composition, functions well as a LED encapsulating material in that it provides one or more of optical clarity, thermal stability, ultraviolet light resistance, melt-processability and injection-moldability. The resulting LED resists deformation after setting or hardening under typical solder reflow conditions.
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