Invention Grant
- Patent Title: Micromechanical structure, method for manufacturing a micromechanical structure, and use of a micromechanical structure
- Patent Title (中): 微机械结构,微机械结构的制造方法以及微机械结构的使用
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Application No.: US12924160Application Date: 2010-09-21
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Publication No.: US08530982B2Publication Date: 2013-09-10
- Inventor: Johannes Classen , Christian Bierhoff
- Applicant: Johannes Classen , Christian Bierhoff
- Applicant Address: DE Stuttgart
- Assignee: Robert Bosch GmbH
- Current Assignee: Robert Bosch GmbH
- Current Assignee Address: DE Stuttgart
- Agency: Kenyon & Kenyon LLP
- Priority: DE102009045421 20091007
- Main IPC: H01L29/84
- IPC: H01L29/84

Abstract:
A micromechanical structure which includes a substrate having a main plane of extension, and a seismic mass which is movable relative to the substrate. The micromechanical structure includes a fixed electrode which is connected to the substrate, and a counterelectrode which is connected to the seismic mass. The fixed electrode has a first fixed electrode region and a second fixed electrode region which is connected in an electrically conductive manner to the first fixed electrode region. The counterelectrode is partially situated between the first and the second fixed electrode region, perpendicular to the main plane of extension.
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