A method for manufacturing a chip is disclosed. The method comprises forming a material structure in a kerf adjacent the chip on a wafer. The method further comprises selectively removing the material structure in the kerf and dicing the wafer.A semiconductor wafer is disclosed. The semiconductor wafer comprises a plurality of chips and a plurality of kerfs. The kerfs separate the chips from each other. At least one kerf comprises a kerf framing. The kerf framing is arranged directly adjacent a side of the at least on chip.