Invention Grant
US08531017B2 Semiconductor packages having increased input/output capacity and related methods
有权
具有增加的输入/输出容量和相关方法的半导体封装
- Patent Title: Semiconductor packages having increased input/output capacity and related methods
- Patent Title (中): 具有增加的输入/输出容量和相关方法的半导体封装
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Application No.: US13026991Application Date: 2011-02-14
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Publication No.: US08531017B2Publication Date: 2013-09-10
- Inventor: Guo-Cheng Liao
- Applicant: Guo-Cheng Liao
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Agency: Klein, O'Neill & Singh, LLP
- Priority: TW99131048A 20100914
- Main IPC: H01L23/495
- IPC: H01L23/495
Abstract:
A semiconductor package includes leads around the periphery of a chip and leads under the chip having connecting segments for increasing I/O capability. A filling material may be used under the chip, which may provide a lead locking function. Various methods of forming the semiconductor package are further provided.
Public/Granted literature
- US20120061808A1 SEMICONDUCTOR PACKAGES HAVING INCREASED INPUT/OUTPUT CAPACITY AND RELATED METHODS Public/Granted day:2012-03-15
Information query
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