Invention Grant
US08531018B2 Component comprising a chip in a cavity and a stress-reduced attachment
有权
包括空腔中的芯片和应力减小的附件的部件
- Patent Title: Component comprising a chip in a cavity and a stress-reduced attachment
- Patent Title (中): 包括空腔中的芯片和应力减小的附件的部件
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Application No.: US13050260Application Date: 2011-03-17
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Publication No.: US08531018B2Publication Date: 2013-09-10
- Inventor: Wolfgang Pahl
- Applicant: Wolfgang Pahl
- Applicant Address: DE Munich
- Assignee: Epcos AG
- Current Assignee: Epcos AG
- Current Assignee Address: DE Munich
- Agency: Nixon Peabody LLP
- Priority: DE102010012042 20100319
- Main IPC: H01L23/02
- IPC: H01L23/02 ; H01L23/48 ; H01L23/52
Abstract:
A mechanically improved component comprising a chip in a cavity and a stress-reduced attachment is specified. A component comprises an opening in a housing, an opaque cover or a mechanically flexible line connector, which is attached to two locations.
Public/Granted literature
- US20110230068A1 COMPONENT COMPRISING A CHIP IN A CAVITY AND A STRESS-REDUCED ATTACHMENT Public/Granted day:2011-09-22
Information query
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