Invention Grant
US08531044B2 Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated with an encapsulant prepared from the composition
有权
用于封装半导体器件的环氧树脂组合物和用由组合物制备的密封剂封装的半导体器件
- Patent Title: Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated with an encapsulant prepared from the composition
- Patent Title (中): 用于封装半导体器件的环氧树脂组合物和用由组合物制备的密封剂封装的半导体器件
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Application No.: US13338421Application Date: 2011-12-28
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Publication No.: US08531044B2Publication Date: 2013-09-10
- Inventor: Seung Han , Yun Ling
- Applicant: Seung Han , Yun Ling
- Applicant Address: KR Gum-si, Kyeongsangbuk-do
- Assignee: Cheil Industries, Inc.
- Current Assignee: Cheil Industries, Inc.
- Current Assignee Address: KR Gum-si, Kyeongsangbuk-do
- Agency: Lee & Morse, P.C.
- Priority: KR10-2010-0140050 20101231; KR10-2011-0107723 20111020
- Main IPC: H01L23/29
- IPC: H01L23/29
Abstract:
An epoxy resin composition for encapsulating a semiconductor device and a semiconductor device, the composition including an epoxy resin, a curing agent, a curing accelerator, an inorganic filler, and an additive, wherein the epoxy resin includes an epoxy resin represented by Formula 1:
Public/Granted literature
Information query
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