Invention Grant
- Patent Title: Light module
- Patent Title (中): 灯模块
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Application No.: US13320987Application Date: 2010-05-05
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Publication No.: US08531111B2Publication Date: 2013-09-10
- Inventor: Egbert Lenderink , Oscar Hendrikus Willemsen , Georges Marie Calon
- Applicant: Egbert Lenderink , Oscar Hendrikus Willemsen , Georges Marie Calon
- Applicant Address: NL Eindhoven
- Assignee: Koninklijke Philips N.V.
- Current Assignee: Koninklijke Philips N.V.
- Current Assignee Address: NL Eindhoven
- Agent Mark L. Beloborodov
- Priority: EP09160796 20090520
- International Application: PCT/IB2010/051976 WO 20100505
- International Announcement: WO2005/133993 WO 20101125
- Main IPC: H05B37/02
- IPC: H05B37/02

Abstract:
The invention relates to a light module for electrical and thermal attachment to an energy infrastructure having at least one power supply, each power supply comprising two electrodes, said light module comprising a light source to emit light, wherein the light source is a heat source when emitting light, two electrical contacts to contact the electrodes of the at least one power supply and thereby establishing the electrical attachment between the light module and the energy infrastructure, a control system arranged between the light source and the electrical contacts to control a power supplied to the light source, wherein the light module comprises a measurement system to measure a thermal resistance of the thermal attachment between the light module and the energy infrastructure when establishing the electrical attachment, and wherein the control system is configured to reduce the power supplied to the light source when the thermal resistance is above a predetermined value to protect the light module from overheating. The invention also relates to a method for protecting a light module from overheating.
Public/Granted literature
- US20120062121A1 LIGHT MODULE Public/Granted day:2012-03-15
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