Invention Grant
US08531191B2 Sensor assembly and methods of measuring a proximity of a machine component to a sensor
有权
传感器组件和测量机器部件与传感器的接近度的方法
- Patent Title: Sensor assembly and methods of measuring a proximity of a machine component to a sensor
- Patent Title (中): 传感器组件和测量机器部件与传感器的接近度的方法
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Application No.: US12951438Application Date: 2010-11-22
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Publication No.: US08531191B2Publication Date: 2013-09-10
- Inventor: Raymond Jensen , Dwayne Folden , Philip Hanifan
- Applicant: Raymond Jensen , Dwayne Folden , Philip Hanifan
- Applicant Address: US NY Schenectady
- Assignee: General Electric Company
- Current Assignee: General Electric Company
- Current Assignee Address: US NY Schenectady
- Agency: Global Patent Operation
- Agent Mark A. Conklin
- Main IPC: G01R27/04
- IPC: G01R27/04

Abstract:
A microwave sensor assembly includes a signal generator for generating at least one microwave signal and an emitter coupled to the signal generator. The emitter is configured to generate an electromagnetic field from the at least one microwave signal, wherein the emitter is detuned when an object is positioned within the electromagnetic field such that a loading signal is generated. The microwave sensor assembly also includes a detector coupled to the emitter and to the signal generator. The detector is configured to calculate at least one of an amplitude, a phase, and a power of the loading signal at a primary frequency of the loading signal for use in measuring a proximity of an object to the emitter.
Public/Granted literature
- US20120126830A1 Sensor Assembly And Methods Of Measuring A Proximity Of A Machine Component To A Sensor Public/Granted day:2012-05-24
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