Invention Grant
US08531806B2 Distributed building blocks of R-C clamping circuitry in semiconductor die core area
有权
半导体芯片区域中R-C钳位电路的分布式构建块
- Patent Title: Distributed building blocks of R-C clamping circuitry in semiconductor die core area
- Patent Title (中): 半导体芯片区域中R-C钳位电路的分布式构建块
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Application No.: US13173977Application Date: 2011-06-30
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Publication No.: US08531806B2Publication Date: 2013-09-10
- Inventor: Reza Jalilizeinali , Evan Siansuri , Sreeker R. Dundigal , Eugene R. Worley
- Applicant: Reza Jalilizeinali , Evan Siansuri , Sreeker R. Dundigal , Eugene R. Worley
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agent Sam Talpalatsky; Nicholas J. Pauley; Joseph Agusta
- Main IPC: H02H3/22
- IPC: H02H3/22
Abstract:
A semiconductor die includes resistor-capacitor (RC) clamping circuitry for electrostatic discharge (ESD) protection of the semiconductor die. The RC clamping circuitry includes building blocks distributed in the pad ring and in the core area of the semiconductor die. The building blocks include at least one capacitor block in the core area. The RC clamping circuitry also includes chip level conductive layer connections between each of the distributed building blocks.
Public/Granted literature
- US20120224284A1 DISTRIBUTED BUILDING BLOCKS OF R-C CLAMPING CIRCUITRY IN SEMICONDUCTOR DIE CORE AREA Public/Granted day:2012-09-06
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