Invention Grant
US08531821B2 System for securing a semiconductor device to a printed circuit board
有权
用于将半导体器件固定到印刷电路板的系统
- Patent Title: System for securing a semiconductor device to a printed circuit board
- Patent Title (中): 用于将半导体器件固定到印刷电路板的系统
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Application No.: US13016701Application Date: 2011-01-28
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Publication No.: US08531821B2Publication Date: 2013-09-10
- Inventor: Eli Holzman , Paul Brian Hafeli , Robert Michael Sterns
- Applicant: Eli Holzman , Paul Brian Hafeli , Robert Michael Sterns
- Applicant Address: US MA Waltham
- Assignee: Raytheon Company
- Current Assignee: Raytheon Company
- Current Assignee Address: US MA Waltham
- Agency: Cantor Colburn LLP
- Main IPC: H05K7/10
- IPC: H05K7/10 ; H05K7/12
Abstract:
In accordance with the teaching of the present invention, a system and method for securing a ball grid array to a printed wire board is provided. In a particular embodiment, a ball grid array comprises one or more balls configured to attach to a spring comprising one or more turns. In addition, there is a spacer plate configured to align and separate the springs, a soldering aid configured to align solder on the printed wire board and a printed wire board configured with conductive pads to attach to the ball grid array via the springs.
Public/Granted literature
- US20120195015A1 SYSTEM AND METHOD FOR SECURING A SEMICONDUCTOR DEVICE TO A PRINTED WIRE BOARD Public/Granted day:2012-08-02
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