Invention Grant
- Patent Title: Pad mechanism capable of adjusting height thereof and electronic device therewith
- Patent Title (中): 能够调整其高度的垫片机构和电子设备
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Application No.: US13330621Application Date: 2011-12-19
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Publication No.: US08531837B2Publication Date: 2013-09-10
- Inventor: Jia-Hung Lee , Chien-Heng Kuo , Yen-Chang Lai
- Applicant: Jia-Hung Lee , Chien-Heng Kuo , Yen-Chang Lai
- Applicant Address: TW Hsichih, New Taipei
- Assignee: Wistron Corporation
- Current Assignee: Wistron Corporation
- Current Assignee Address: TW Hsichih, New Taipei
- Agent Winston Hsu; Scott Margo
- Priority: TW100123833A 20110706
- Main IPC: H05K5/00
- IPC: H05K5/00

Abstract:
A pad mechanism includes a step fixing structure having a plurality of step platforms. A height difference is formed between the two step platforms. A first engaging portion is formed on each step platform. The pad mechanism further includes a pad component having a pad body, a sleeve and a constraining portion. A second engaging portion is formed on the pad body for selectively engaging with the corresponding first engaging portion so as to adjust a height of the pad body protruding from the step fixing structure. The pad mechanism further includes a resilient component sheathing with the sleeve for driving the sleeve, and a constraining component installed on a side of the resilient component and connected to the constraining portion so as to prevent the resilient component from separating from the sleeve.
Public/Granted literature
- US20130010448A1 PAD MECHANISM CAPABLE OF ADJUSTING HEIGHT THEREOF AND ELECTRONIC DEVICE THEREWITH Public/Granted day:2013-01-10
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