Invention Grant
US08531849B1 Supply voltage or ground connections including bond pad interconnects for integrated circuit device
有权
电源电压或接地连接，包括用于集成电路器件的焊盘互连
- Patent Title: Supply voltage or ground connections including bond pad interconnects for integrated circuit device
- Patent Title (中): 电源电压或接地连接，包括用于集成电路器件的焊盘互连
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Application No.: US12751695Application Date: 2010-03-31
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Publication No.: US08531849B1Publication Date: 2013-09-10
- Inventor: Mostafa Naguib Abdulla , Steven Eskildsen
- Applicant: Mostafa Naguib Abdulla , Steven Eskildsen
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Knobbe Martens Olson & Bear LLP
- Main IPC: H05K7/10
- IPC: H05K7/10
Abstract:
Embodiments disclosed herein may relate to supply voltage or ground connections for integrated circuit devices. As one example, two or more supply voltage bond pads on an integrated circuit die may be connected together via one or more electrically conductive interconnects.
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