Invention Grant
US08531882B2 Semiconductor memory device including a plurality of stacked semiconductor memory chips
有权
半导体存储器件包括多个堆叠的半导体存储器芯片
- Patent Title: Semiconductor memory device including a plurality of stacked semiconductor memory chips
- Patent Title (中): 半导体存储器件包括多个堆叠的半导体存储器芯片
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Application No.: US13159696Application Date: 2011-06-14
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Publication No.: US08531882B2Publication Date: 2013-09-10
- Inventor: Tomofumi Fujimura , Yuui Shimizu
- Applicant: Tomofumi Fujimura , Yuui Shimizu
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2010-135950 20100615
- Main IPC: G11C16/06
- IPC: G11C16/06

Abstract:
A memory includes stacking chips. The chip includes a pad commonly connected to the chips and receiving an enable signal that enables access to each chip. The chip includes a chip address memory that can store a chip address. The chip includes a determining part comparing a select address to the chip address for determining whether they match each other. The chip includes a control-signal setting part setting the control signal inputted to the chip itself to be valid or invalid depending on a determination made by the determining part. The chip includes a chip-address setting part determining whether the chip address is stored in the chip address memory depending on number of fail bits. The device includes a memory controller allocating respectively different ones of the chip addresses to the chips based on the number of fail bits.
Public/Granted literature
- US20110305086A1 SEMICONDUCTOR MEMORY DEVICE Public/Granted day:2011-12-15
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