Invention Grant
US08531882B2 Semiconductor memory device including a plurality of stacked semiconductor memory chips 有权
半导体存储器件包括多个堆叠的半导体存储器芯片

Semiconductor memory device including a plurality of stacked semiconductor memory chips
Abstract:
A memory includes stacking chips. The chip includes a pad commonly connected to the chips and receiving an enable signal that enables access to each chip. The chip includes a chip address memory that can store a chip address. The chip includes a determining part comparing a select address to the chip address for determining whether they match each other. The chip includes a control-signal setting part setting the control signal inputted to the chip itself to be valid or invalid depending on a determination made by the determining part. The chip includes a chip-address setting part determining whether the chip address is stored in the chip address memory depending on number of fail bits. The device includes a memory controller allocating respectively different ones of the chip addresses to the chips based on the number of fail bits.
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