Invention Grant
- Patent Title: Earphone assembly with moisture resistance
- Patent Title (中): 耳机组合防潮
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Application No.: US13009234Application Date: 2011-01-19
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Publication No.: US08532323B2Publication Date: 2013-09-10
- Inventor: Timothy K. Wickstrom , William J. Ballad , Mei-Yu Lin , Ying-Tzu Chan , Jen Nan Feng
- Applicant: Timothy K. Wickstrom , William J. Ballad , Mei-Yu Lin , Ying-Tzu Chan , Jen Nan Feng
- Applicant Address: US IL Itasca
- Assignee: Knowles Electronics, LLC
- Current Assignee: Knowles Electronics, LLC
- Current Assignee Address: US IL Itasca
- Agency: Fitch, Even, Tabin & Flannery LLP
- Main IPC: H04R1/20
- IPC: H04R1/20 ; H04R25/00

Abstract:
An acoustic system includes a receiver or microphone, a tube, a barrier, and an equalization device. The receiver is capable of outputting an audio signal. The tube is in connection with the receiver and the audio signal travels along a length of the tube. The barrier is fitted along the tube and the barrier prevents moisture from passing along the tube toward the receiver. The barrier causes an amount of damping to the audio signal. The equalization device is in connection with the receiver and the equalization device counteracts the damping by the barrier. The barrier is configured to have a submersion rating greater than or equal to 7 IP.
Public/Granted literature
- US20110182455A1 EARPHONE ASSEMBLY WITH MOISTURE RESISTANCE Public/Granted day:2011-07-28
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