Invention Grant
- Patent Title: Headphone
- Patent Title (中): 耳机
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Application No.: US12075521Application Date: 2008-03-12
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Publication No.: US08532324B2Publication Date: 2013-09-10
- Inventor: Yuusuke Oosato , Koji Nageno
- Applicant: Yuusuke Oosato , Koji Nageno
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Wolf, Greenfield & Sacks, P.C.
- Priority: JP2007-063989 20070313
- Main IPC: H04R1/00
- IPC: H04R1/00

Abstract:
A headphone including a housing that includes a speaker unit, and a protruding portion, provided at a specified area of one surface of the housing, that outputs playback sound generated from the speaker unit. When being worn on the head, the one surface of the housing comes in to contact with an outward facing surface of an auricle surrounding a cavity of a concha, and the protruding portion is inserted in to the cavity of the concha.
Public/Granted literature
- US20080273737A1 Headphone Public/Granted day:2008-11-06
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