Invention Grant
- Patent Title: Electronic device, cover and method
- Patent Title (中): 电子设备,封面及方法
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Application No.: US13270414Application Date: 2011-10-11
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Publication No.: US08532480B2Publication Date: 2013-09-10
- Inventor: Joni Hietala , Juho Jalava , Anu Laine
- Applicant: Joni Hietala , Juho Jalava , Anu Laine
- Applicant Address: FI Vantaa
- Assignee: Lite-On Mobile Oyj
- Current Assignee: Lite-On Mobile Oyj
- Current Assignee Address: FI Vantaa
- Agency: Young & Thompson
- Priority: FI20106071 20101015
- Main IPC: G03B17/02
- IPC: G03B17/02

Abstract:
A cover part for an electronic device, an electronic device and a method. The cover structure (2) for an electronic device provides a cavity (3) into which an electronic part of the electronic device (1) may be arranged. The cover structure (2) includes an enclosing structure (5), which is tubular in shape and at least one end (6a, 6b) of which enclosing structure (5) is open, the end (6a, 6b) including a receiving structure (7a, 7b) for fitting an end element (8a, 8b), which closes the end, into the enclosing structure (5).
Public/Granted literature
- US20120093498A1 ELECTRONIC DEVICE, COVER AND METHOD Public/Granted day:2012-04-19
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