Invention Grant
US08532789B2 Subcutaneous lead fixation mechanisms 有权
皮下引线固定机制

  • Patent Title: Subcutaneous lead fixation mechanisms
  • Patent Title (中): 皮下引线固定机制
  • Application No.: US11364308
    Application Date: 2006-02-28
  • Publication No.: US08532789B2
    Publication Date: 2013-09-10
  • Inventor: Karel Smits
  • Applicant: Karel Smits
  • Applicant Address: US MN Minneapolis
  • Assignee: Medtronic, Inc.
  • Current Assignee: Medtronic, Inc.
  • Current Assignee Address: US MN Minneapolis
  • Agent Carol F. Barry
  • Main IPC: A61N1/00
  • IPC: A61N1/00
Subcutaneous lead fixation mechanisms
Abstract:
A medical device that includes a lead having a lead body extending from a proximal end to a distal end, and a housing having a connector block for receiving the proximal end of the lead body. A fixation mechanism is positioned proximal to an electrode coil located at the distal end of the lead body, and includes a locking sleeve and a mating portion positioned along the lead body proximal to the electrode. The fixation mechanism is capable of being advance from a first state corresponding to a first inner diameter of the locking sleeve and a second state corresponding to a second inner diameter of the locking sleeve greater than the first inner diameter to fixed position the electrode at a target site.
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