Invention Grant
- Patent Title: System for testing connections between chips
- Patent Title (中): 用于测试芯片之间连接的系统
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Application No.: US12414394Application Date: 2009-03-30
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Publication No.: US08533543B2Publication Date: 2013-09-10
- Inventor: Jens Barrenscheen , Harry Siebert
- Applicant: Jens Barrenscheen , Harry Siebert
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Schiff Hardin LLP
- Main IPC: G01R31/28
- IPC: G01R31/28

Abstract:
In accordance with an aspect of the application, there is provided a system for testing, including a first chip, a second chip, and first and second connections. The first connection is configured to couple a first pin of the first chip to a first pin of the second chip, and to transmit an initial signal from the first chip to the second chip. The second connection is configured to couple a second pin of the first chip to a second pin of the second chip to return the signal as a returned signal to the first chip. The first chip comprises comparison circuitry configured to compare the returned signal with the initial signal.
Public/Granted literature
- US20100244848A1 SYSTEM FOR TESTING CONNECTIONS BETWEEN CHIPS Public/Granted day:2010-09-30
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