Invention Grant
- Patent Title: Wrapper cell for hierarchical system on chip testing
- Patent Title (中): 用于分级系统片上测试的包装盒
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Application No.: US12944295Application Date: 2010-11-11
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Publication No.: US08533548B2Publication Date: 2013-09-10
- Inventor: Kyuchull Kim , Kewal K. Saluja
- Applicant: Kyuchull Kim , Kewal K. Saluja
- Applicant Address: US WI Madison
- Assignee: Wisconsin Alumni Research Foundation
- Current Assignee: Wisconsin Alumni Research Foundation
- Current Assignee Address: US WI Madison
- Agency: Boyle Fredrickson S.C.
- Main IPC: G01R31/28
- IPC: G01R31/28
Abstract:
Wrapper cells for simultaneous testing of parent functional elements and child functional elements in a hierarchical SoC (System on Chip) provide a substantially reduced integrated circuit footprint by eliminating a multiplexer and providing simpler interconnections. Identical wrapper cells may be used for input and output data lines reducing the cost of the cell library.
Public/Granted literature
- US20120124439A1 Wrapper Cell for Hierarchical System on Chip Testing Public/Granted day:2012-05-17
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