Invention Grant
- Patent Title: Pressure sensitive shrink label
- Patent Title (中): 压敏收缩标签
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Application No.: US12532845Application Date: 2008-04-04
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Publication No.: US08535464B2Publication Date: 2013-09-17
- Inventor: James P. Lorence , Craig W. Potter , Mitchell J. Rackovan , Richard D. Pastor , William L. Cone
- Applicant: James P. Lorence , Craig W. Potter , Mitchell J. Rackovan , Richard D. Pastor , William L. Cone
- Applicant Address: US CA Pasadena
- Assignee: Avery Dennison Corporation
- Current Assignee: Avery Dennison Corporation
- Current Assignee Address: US CA Pasadena
- Agency: Avery Dennison Corporation
- International Application: PCT/US2008/059397 WO 20080404
- International Announcement: WO2008/124581 WO 20081016
- Main IPC: B32B3/10
- IPC: B32B3/10
Abstract:
A label for application to a surface having at least one compound curve is provided. The label comprises a heat shrinkable film having an inner surface and outer surface and a layer of pressure sensitive adhesive on the inner surface of the heat shrinkable film.
Public/Granted literature
- US20100112263A1 PRESSURE SENSITIVE SHRINK LABEL Public/Granted day:2010-05-06
Information query
