Invention Grant
- Patent Title: Polyamide resistant to heat aging
- Patent Title (中): 聚酰胺耐热老化
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Application No.: US13504299Application Date: 2010-10-18
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Publication No.: US08536247B2Publication Date: 2013-09-17
- Inventor: Manoranjan Prusty , Martin Baumert , Axel Wilms , Philippe Desbois , Alexander Traut , Gerald Lippert , Jordan Kurikov
- Applicant: Manoranjan Prusty , Martin Baumert , Axel Wilms , Philippe Desbois , Alexander Traut , Gerald Lippert , Jordan Kurikov
- Applicant Address: DE Ludwigshafen
- Assignee: BASF SE
- Current Assignee: BASF SE
- Current Assignee Address: DE Ludwigshafen
- Agency: Novak Druce Connolly Bove + Quigg LLP
- Priority: EP09174173 20091027; EP10162960 20100517
- International Application: PCT/EP2010/065582 WO 20101018
- International Announcement: WO2011/051123 WO 20110505
- Main IPC: C08K9/08
- IPC: C08K9/08 ; C08K9/00
Abstract:
Thermoplastic molding compositions, comprising A) from 10 to 99.999% by weight of a polyimide B) from 0.001 to 20% by weight of iron powder with a particle size of at most 10 μm (d50 value), which is obtainable via thermal decomposition of pentacarbonyliron, C) from 0 to 70% by weight of further additives, where the total of the percentages by weight of components A) to C) is 100%.
Public/Granted literature
- US20120214904A1 POLYAMIDE RESISTANT TO HEAT AGING Public/Granted day:2012-08-23
Information query
