Invention Grant
- Patent Title: MEMS sensor with dual proof masses
- Patent Title (中): 具有双重质量的MEMS传感器
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Application No.: US13012671Application Date: 2011-01-24
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Publication No.: US08539836B2Publication Date: 2013-09-24
- Inventor: Andrew C. McNeil
- Applicant: Andrew C. McNeil
- Applicant Address: US TX Austin
- Assignee: Freescale Semiconductor, Inc.
- Current Assignee: Freescale Semiconductor, Inc.
- Current Assignee Address: US TX Austin
- Agency: Schmeiser, Olsen & Watts LLP
- Agent Lowell W. Gresham; Charlene R. Jacobsen
- Main IPC: G01P15/125
- IPC: G01P15/125

Abstract:
A microelectromechanical systems (MEMS) sensor (20) includes a substrate (26) and suspension anchors (34, 36) formed on a planar surface (28) of the substrate (26). The MEMS sensor (20) further includes a first movable element (38) and a second movable element (40) suspended above the substrate (26). Compliant members (42, 44) interconnect the first movable element (38) with the suspension anchor 34 and compliant members (46, 48) interconnect the second movable element (40) with the suspension anchor (36). The movable elements (38, 40) have an equivalent shape. The movable elements may be generally rectangular movable elements (38, 40) or L-shaped movable elements (108, 110) in a nested configuration. The movable elements (38, 40) are oriented relative to one another in rotational symmetry about a point location (94) on the substrate (26).
Public/Granted literature
- US20120186347A1 MEMS SENSOR WITH DUAL PROOF MASSES Public/Granted day:2012-07-26
Information query
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