Invention Grant
- Patent Title: Support mechanism
- Patent Title (中): 支持机制
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Application No.: US13316904Application Date: 2011-12-12
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Publication No.: US08540202B2Publication Date: 2013-09-24
- Inventor: Wu-Zhu Hu , Wu-Qi Li , Ben-Xiang Zhao , Tang Li
- Applicant: Wu-Zhu Hu , Wu-Qi Li , Ben-Xiang Zhao , Tang Li
- Applicant Address: CN Shenzhen TW New Taipei
- Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen TW New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN201110179261 20110629
- Main IPC: A45D19/04
- IPC: A45D19/04

Abstract:
A support mechanism for supporting an electronic device is disclosed. The support mechanism, comprises at least one connecting assembly; and at least one pair of support portions, each of the at least one pair of support portions comprising a first support member, a connecting member comprising a first connecting end and a second connecting end, and a second support member; wherein the first support member is rotatably connected to the connecting member at the first connecting end, the second support member is rotatably connected to the second connecting member at the second connecting end, and the second support members of each of the at least one pair of support portions are rotatably connected to each other by the at least one connecting assembly.
Public/Granted literature
- US20130001381A1 SUPPORT MECHANISM Public/Granted day:2013-01-03
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