A connecting structure to connect electronic components electrically through a plurality of conducting lines each including a covered segment including a wire conductor covered with an insulating covering and an uncovered segment includes a molding unit and a sealing unit. The molding unit encloses a boundary portion between the covered segment and the uncovered segment of each of the conducting lines so that the uncovered segments project in a first direction from a first end of the molding unit and the covered segments project in a second direction from a second end of the molding unit, and thereby holding the conducting lines to fix positions of the conducting lines relative to one another. The sealing member of an adhesive adheres to the second end of the molding unit and adheres to each of the covered segments of the conducting lines projecting from the second end of the molding unit.