Invention Grant
- Patent Title: Laminated ceramic electronic component and manufacturing method therefor
- Patent Title (中): 层压陶瓷电子元件及其制造方法
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Application No.: US13004213Application Date: 2011-01-11
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Publication No.: US08540832B2Publication Date: 2013-09-24
- Inventor: Yosuke Hirata , Hideaki Tsuji , Nagato Omori , Hiroyuki Wada , Takashi Hiramatsu , Yoshito Saito
- Applicant: Yosuke Hirata , Hideaki Tsuji , Nagato Omori , Hiroyuki Wada , Takashi Hiramatsu , Yoshito Saito
- Applicant Address: JP Nagaokakyo-Shi, Kyoto-fu
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Nagaokakyo-Shi, Kyoto-fu
- Agency: Dickstein Shapiro LLP
- Priority: JP2009-141866 20090615; JP2009-156655 20090701
- Main IPC: C03B29/00
- IPC: C03B29/00

Abstract:
Changes in states giving rise to electrode breakage and ball formation are made less likely during firing step for sintering the laminated body, and the improvement in DC bias characteristics is achieved in laminated ceramic electronic components with a laminated body which has internal electrodes, even when ceramic layers and the internal electrodes are reduced in thickness. The laminated body is divided into a large grain region in which the ceramic has a relatively large grain diameter and a small grain region in which the ceramic has a relatively small grain diameter. The large grain region is located outside the small grain region, and a boundary surface between the large grain region and the small grain region is located inside the outer surface of the laminated body while surrounding a section in which the internal electrodes are present in the laminated body. In order to obtain the laminated body, a heat treatment is carried out in the firing step with a temperature profile in which the average rate of temperature increase from room temperature to the maximum temperature is 40° C./second or more.
Public/Granted literature
- US20110110014A1 LAMINATED CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR Public/Granted day:2011-05-12
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