Invention Grant
- Patent Title: Target arrangement for mounting / dismounting and method of manufacturing
- Patent Title (中): 安装/拆卸的目标布置及制造方法
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Application No.: US11639034Application Date: 2006-12-14
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Publication No.: US08540850B2Publication Date: 2013-09-24
- Inventor: Marcel Neusch , Peter Schlegel , Hartmut Rohrmann , Oliver Rattunde
- Applicant: Marcel Neusch , Peter Schlegel , Hartmut Rohrmann , Oliver Rattunde
- Applicant Address: LI Balzers
- Assignee: OC Oerlikon Balzers AG
- Current Assignee: OC Oerlikon Balzers AG
- Current Assignee Address: LI Balzers
- Agency: Notaro, Michalos & Zaccaria P.C.
- Priority: EP05028296 20051223
- Main IPC: C23C14/00
- IPC: C23C14/00

Abstract:
So as to provide a target arrangement with improved mounting and dismounting ability, the target arrangement comprises a plate along a plane (E) which has a border (7) defined by a first wedge surface (5u) angled to the addressed general plane (E) and a second wedge surface (5l) which is substantially planar as well and angled with respect to the generic plane (E). The two wedge surfaces mutually convert in a direction along the addressed plane (E) and from a more central area of the plate outwardly.
Public/Granted literature
- US20070144899A1 Target arrangement for mounting / dismounting and method of manufacturing Public/Granted day:2007-06-28
Information query
IPC分类: