Invention Grant
- Patent Title: Chemical mechanical polishing composition and methods relating thereto
- Patent Title (中): 化学机械抛光组合物及其相关方法
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Application No.: US12185600Application Date: 2008-08-04
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Publication No.: US08540893B2Publication Date: 2013-09-24
- Inventor: Tirthankar Ghosh , Terence M. Thomas , Hongyu Wang , Scott A. Ibbitson
- Applicant: Tirthankar Ghosh , Terence M. Thomas , Hongyu Wang , Scott A. Ibbitson
- Applicant Address: US DE Newark
- Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
- Current Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
- Current Assignee Address: US DE Newark
- Agent Thomas S. Deibert
- Main IPC: C09K13/00
- IPC: C09K13/00 ; C09K13/04 ; H01R13/04 ; C03C15/00 ; C03C25/68
Abstract:
A chemical mechanical polishing composition useful for chemical mechanical polishing of a patterned semiconductor wafer containing a nonferrous metal. The chemical mechanical polishing composition comprises an inhibitor for the nonferrous metal; a copolymer of poly(ethylene glycol)methyl ether (meth)acrylate and 1-vinylimidazole; and water.
Public/Granted literature
- US20100029079A1 Chemical mechanical polishing composition and methods relating thereto Public/Granted day:2010-02-04
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