Invention Grant
- Patent Title: Electrically conductive paste, and electrical and electronic device comprising the same
- Patent Title (中): 导电膏，以及包含该导电膏的电气和电子设备
-
Application No.: US12744994Application Date: 2008-11-21
-
Publication No.: US08540903B2Publication Date: 2013-09-24
- Inventor: Takayuki Higuchi , Hidenori Miyakawa , Atsushi Yamaguchi , Arata Kishi , Naomichi Ohashi
- Applicant: Takayuki Higuchi , Hidenori Miyakawa , Atsushi Yamaguchi , Arata Kishi , Naomichi Ohashi
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JPP2007-307125 20071128
- International Application: PCT/JP2008/003433 WO 20081121
- International Announcement: WO2009/069273 WO 20090604
- Main IPC: H01B1/02
- IPC: H01B1/02 ; H01B1/22 ; H01B1/12 ; H05K3/20 ; H05K3/30 ; H05K1/00 ; H05K1/18 ; H05K7/00
Abstract:
Disclosed is an electrically conductive paste which enables to reduce the level of void growth in a conducting pathway formed in a joint part produced after curing the electrically conductive paste in the implementation of an electronic component on a circuit board by using the electrically conductive paste, and which contains a reduced amount of a viscosity-adjusting/thixotropy-imparting additive. Two Sn-containing low-melting-point alloy particles having different melting points and different average particle diameters are selected as electrically conductive filler components to be used in an electrically conductive paste, and the two alloy particles are mixed at a predetermined ratio for use.
Public/Granted literature
- US20110049439A1 ELECTRICALLY CONDUCTIVE PASTE, AND ELECTRICAL AND ELECTRONIC DEVICE COMPRISING THE SAME Public/Granted day:2011-03-03
Information query
