Invention Grant
- Patent Title: Positive resist compositions and patterning process
- Patent Title (中): 正极抗蚀剂组成和图案化工艺
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Application No.: US13013143Application Date: 2011-01-25
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Publication No.: US08541158B2Publication Date: 2013-09-24
- Inventor: Wataru Kusaki , Takeshi Kinsho , Takeru Watanabe
- Applicant: Wataru Kusaki , Takeshi Kinsho , Takeru Watanabe
- Applicant Address: JP Tokyo
- Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2010-013777 20100126
- Main IPC: G03F7/039
- IPC: G03F7/039 ; G03F7/20 ; G03F7/30 ; G03F7/38

Abstract:
A positive resist composition is provided comprising an acid generator, a resin component which generates resin-solubilizing groups under the action of acid so that the resin component becomes soluble in an alkaline developer, at least some resin-solubilizing groups being carboxyl groups, and a compound for activating or condensing a carboxyl group. When processed by the lithography, the resist composition forms a resist pattern having a very high resolution and good mask fidelity.
Public/Granted literature
- US20110183262A1 POSITIVE RESIST COMPOSITIONS AND PATTERNING PROCESS Public/Granted day:2011-07-28
Information query
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