A method for manufacturing a light emitting device package includes: preparing a base frame including an annular base part, at least a pair of lead parts extending to an inner side of the base part, and at least one support part extending to the inner side of the base part in a direction different from that of the lead parts and having a step structure formed on at least one surface of an end thereof; forming a package main body such that the package main body is combined to the step structure of the support part; separating the lead parts from the base part; disposing a light emitting device on at least one of the lead parts; and separating the package main body from the support part.