An electrical structure and method for forming electrical interconnects. The method includes positioning a sacrificial carrier substrate such that a first surface of a non-solder metallic core structure within the sacrificial carrier substrate is in contact with a first electrically conductive pad. The first surface is thermo-compression bonded to the first electrically conductive pad. The sacrificial carrier substrate is removed from the non-solder metallic core structure. A solder structure is formed on a second electrically conductive pad. The first substrate comprising the non-solder metallic core structure is positioned such that a second surface of the non-solder metallic core structure is in contact with the solder structure. The solder structure is heated to a temperature sufficient to cause the solder structure to melt and form an electrical and mechanical connection between the second surface of the non-solder metallic core structure and the second electrically conductive pad.