Invention Grant
- Patent Title: Processing assembly for semiconductor workpiece and methods of processing same
- Patent Title (中): 半导体工件加工组件及其加工方法
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Application No.: US12960372Application Date: 2010-12-03
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Publication No.: US08541309B2Publication Date: 2013-09-24
- Inventor: Jason Rye , Kyle M. Hanson
- Applicant: Jason Rye , Kyle M. Hanson
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED Materials, Inc.
- Current Assignee: APPLIED Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Christensen O'Connor Johnson Kindness PLLC
- Main IPC: H01L21/302
- IPC: H01L21/302
Abstract:
A processing assembly for a semiconductor workpiece generally includes a rotor assembly capable of spinning a workpiece, a chemistry delivery assembly for delivering chemistry to the workpiece, and a chemistry collection assembly for collecting spent chemistry from the workpiece. The chemistry collection assembly includes a weir assembly surrounding the rotor assembly and having a plurality of weirs. Methods for processing a semiconductor workpiece generally include moving at least one of the rotor assembly and the weir assembly.
Public/Granted literature
- US20120142196A1 PROCESSING ASSEMBLY FOR SEMICONDUCTOR WORKPIECE AND METHODS OF PROCESSING SAME Public/Granted day:2012-06-07
Information query
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