Invention Grant
US08541310B2 CMP compositions containing a soluble peroxometalate complex and methods of use thereof
有权
含有可溶性过氧金属酸盐络合物的CMP组合物及其使用方法
- Patent Title: CMP compositions containing a soluble peroxometalate complex and methods of use thereof
- Patent Title (中): 含有可溶性过氧金属酸盐络合物的CMP组合物及其使用方法
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Application No.: US11800188Application Date: 2007-05-04
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Publication No.: US08541310B2Publication Date: 2013-09-24
- Inventor: Daniela White , John Parker
- Applicant: Daniela White , John Parker
- Applicant Address: US IL Aurora
- Assignee: Cabot Microelectronics Corporation
- Current Assignee: Cabot Microelectronics Corporation
- Current Assignee Address: US IL Aurora
- Agent Thomas E Omholt; Robert J Ross; Steven D Weseman
- Main IPC: H01L21/32
- IPC: H01L21/32 ; H01L21/461 ; B44C1/22 ; C23F1/00 ; C23F15/00
Abstract:
The present invention provides a chemical-mechanical polishing (CMP) composition for polishing a ruthenium-containing substrate in the presence of hydrogen peroxide without forming a toxic level of ruthenium tetroxide during the polishing process. The composition comprises (a) a catalytic oxidant comprising a water-soluble peroxometalate complex, an oxidizable precursor of a peroxometalate complex, or a combination thereof, (b) a particulate abrasive; and (c) an aqueous carrier. The peroxometalate complex and the precursor thereof each have a reduced form that is oxidizable by hydrogen peroxide to regenerate the peroxometalate complex during chemical-mechanical polishing. CMP methods for polishing ruthenium-containing surfaces with the CMP composition are also provided.
Public/Granted literature
- US20080274619A1 CMP compositions containing a soluble peroxometalate complex and methods of use thereof Public/Granted day:2008-11-06
Information query
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