Invention Grant
- Patent Title: Copolymerized polyether polyamide resin
- Patent Title (中): 共聚聚醚聚酰胺树脂
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Application No.: US12935146Application Date: 2008-10-16
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Publication No.: US08541321B2Publication Date: 2013-09-24
- Inventor: Hiroaki Hagiwara , Kenichiro Kano , Gaku Maruyama , Takahiro Hattori , Takashi Tsuruta
- Applicant: Hiroaki Hagiwara , Kenichiro Kano , Gaku Maruyama , Takahiro Hattori , Takashi Tsuruta
- Applicant Address: JP Osaka
- Assignee: Toyo Boseki Kabushiki Kaisha
- Current Assignee: Toyo Boseki Kabushiki Kaisha
- Current Assignee Address: JP Osaka
- Agency: Fish & Richardson P.C.
- Priority: JP2008-128237 20080515
- International Application: PCT/JP2008/068727 WO 20081016
- International Announcement: WO2009/139087 WO 20091119
- Main IPC: B32B27/24
- IPC: B32B27/24 ; B60R21/16

Abstract:
A copolymerized polyether polyamide resin for coating on or for impregnation to a woven or knitted fabric, wherein elongation and elastic modulus of the copolymerized polyether polyamide resin are not less than 1000% and not more than 15 MPa, respectively. The copolymerized polyether polyamide resin has a constitution wherein said copolymerized polyether polyamide resin is such that a soft segment comprising a polyether polyamide constituted from a polyether diamine compound and a dicarboxylic acid compound is bonded to a hard segment comprising a polyamide constituted from an aminocarboxylic acid compound and/or a lactam compound.
Public/Granted literature
- US20110014833A1 COPOLYMERIZED POLYETHER POLYAMIDE RESIN Public/Granted day:2011-01-20
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