A reversible thermosensitive recording medium including: reversible thermosensitive recording layer; first sheet-shaped base; second sheet-shaped base; first resin layer; second resin layer; and electronic information recording module containing module substrate, and electronic information recording element and antenna circuit disposed on the substrate, wherein the recording layer is provided adjacent to the first sheet-shaped base; the first or second sheet-shaped base has concave portion in which the element is disposed in depth direction thereof; the module is provided between the first and second sheet-shaped bases, where the first resin layer is provided between the module and the sheet-shaped base having the concave portion and the second resin layer is provided between the module and the sheet-shaped base having no concave portion; and inner side surface of the concave portion is tapered surface where maximum opening diameter of the concave portion decreases from opening edge thereof towards bottom surface thereof.