Invention Grant
- Patent Title: Adhesive composition
- Patent Title (中): 粘合剂组合物
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Application No.: US13126679Application Date: 2009-12-22
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Publication No.: US08541495B2Publication Date: 2013-09-24
- Inventor: Kenichi Ishizaki , Muneaki Kano
- Applicant: Kenichi Ishizaki , Muneaki Kano
- Applicant Address: JP Tokyo
- Assignee: Toagosei Co., Ltd.
- Current Assignee: Toagosei Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2008-331246 20081225
- International Application: PCT/JP2009/071346 WO 20091222
- International Announcement: WO2010/074095 WO 20100701
- Main IPC: C08K3/34
- IPC: C08K3/34

Abstract:
An adhesive composition is provided particularly excellent in thermal shock resistance for adhesive strength as well as high shear adhesive strength, peel adhesive strength and impact adhesive strength. The adhesive composition of the present invention contains (a) a 2-cyanoacrylate such as 2-ethoxyethyl 2-cyanoacrylate and (b) a polyfunctional cyanoacrylate having two or more 2-cyanoacryloyl groups, the number average molecular weight of the polyfunctional cyanoacrylate (b) is in the range from 1,000 to 50,000, and preferably from 2,000 to 30,000, and the content of the polyfunctional cyanoacrylate (b) is in the range from 1 to 400 parts by weight, and preferably from 1 to 200 parts by weight based on 100 parts by weight of the 2-cyanoacrylate (a).
Public/Granted literature
- US20110251318A1 ADHESIVE COMPOSITION Public/Granted day:2011-10-13
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