Invention Grant
- Patent Title: Solid-state imaging device, imaging apparatus, and method for manufacturing solid-state imaging device
- Patent Title (中): 固态成像装置，成像装置和制造固态成像装置的方法
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Application No.: US12247865Application Date: 2008-10-08
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Publication No.: US08541730B2Publication Date: 2013-09-24
- Inventor: Masafumi Inuiya
- Applicant: Masafumi Inuiya
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JPP2007-263205 20071009
- Main IPC: H01L27/00
- IPC: H01L27/00 ; H01J40/14
Abstract:
A solid-state imaging device is provided and includes: a substrate; a plurality of photoelectric conversion elements arranged in a one-dimensional or two-dimensional array above the substrate, the plurality of photoelectric conversion elements being divided into a plurality of photoelectric conversion element groups; a plurality of semiconductor substrates between the substrate and the plurality of photoelectric conversion elements, each of the plurality of semiconductor substrates corresponding to each of the plurality of photoelectric conversion element groups; and a signal output section in the plurality of semiconductor substrates. The signal output section outputs a signal corresponding to an electric charge generated in each photoelectric conversion elements of a photoelectric conversion element group corresponding to a semiconductor substrate.
Public/Granted literature
- US20090091806A1 SOLID-STATE IMAGING DEVICE, IMAGING APPARATUS, AND METHOD FOR MANUFACTURING SOLID-STATE IMAGING DEVICE Public/Granted day:2009-04-09
Information query
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