Invention Grant
- Patent Title: Modifiable layered shield assembly
- Patent Title (中): 可修改的分层屏蔽组件
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Application No.: US13437187Application Date: 2012-04-02
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Publication No.: US08541763B2Publication Date: 2013-09-24
- Inventor: Michael P. Roy
- Applicant: Michael P. Roy
- Applicant Address: US PA Malvern
- Assignee: Siemens Medical Solutions USA, Inc.
- Current Assignee: Siemens Medical Solutions USA, Inc.
- Current Assignee Address: US PA Malvern
- Agent Peter Kendall
- Main IPC: G21F5/00
- IPC: G21F5/00

Abstract:
A shield for absorbing radiation emitted by a target during operation of a cyclotron. The shield includes an inner box structure having a recess for receiving the target. In addition, the shield includes a first plurality of shield elements arranged in a layered configuration about the inner box structure. The shield also includes an outer box structure for receiving the inner box structure and the first plurality of shield elements. Further, a second plurality of shield elements is arranged in a layered configuration about the outer box structure. The shield elements are arranged in both horizontal and vertical orientations and are removable.
Public/Granted literature
- US20130020512A1 Modifiable Layered Shield Assembly Public/Granted day:2013-01-24
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