Invention Grant
- Patent Title: Light-emitting-device package and a method for producing the same
- Patent Title (中): 发光器件封装及其制造方法
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Application No.: US13142950Application Date: 2009-12-30
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Publication No.: US08541801B2Publication Date: 2013-09-24
- Inventor: Jin Ha Kim , Masami Nei , Seok Min Hwang , Chung Bae Jeon
- Applicant: Jin Ha Kim , Masami Nei , Seok Min Hwang , Chung Bae Jeon
- Applicant Address: KR Seoul
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2008-0136954 20081230; KR10-2009-0132239 20091228
- International Application: PCT/KR2009/007936 WO 20091230
- International Announcement: WO2010/077082 WO 20100708
- Main IPC: H01L33/00
- IPC: H01L33/00
Abstract:
A light emitting device package includes: a substrate with a mounting surface; a light emitting device bonded to the mounting surface of the substrate; a light reflecting resin part containing a high reflective material, filled on the substrate around the light emitting device so as to extend in a space between the light emitting device and the substrate; and a packing resin part hermetically sealed to cover the light emitting device and the light reflection resin part.
Public/Granted literature
- US20110291143A1 LIGHT-EMITTING-DEVICE PACKAGE AND A METHOD FOR PRODUCING THE SAME Public/Granted day:2011-12-01
Information query
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