Invention Grant
- Patent Title: Mounting substrate and manufacturing method thereof, light-emitting module and illumination device
- Patent Title (中): 安装基板及其制造方法，发光模块和照明装置
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Application No.: US13582330Application Date: 2011-04-27
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Publication No.: US08541805B2Publication Date: 2013-09-24
- Inventor: Atsushi Motoya , Kazuyuki Okano , Minako Akai , Yurika Goto , Naoki Tagami , Makoto Horiuchi , Toshio Mori , Takaari Uemoto , Masahiro Miki
- Applicant: Atsushi Motoya , Kazuyuki Okano , Minako Akai , Yurika Goto , Naoki Tagami , Makoto Horiuchi , Toshio Mori , Takaari Uemoto , Masahiro Miki
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP2010-111519 20100513; JP2010-114808 20100518; JP2010-114809 20100518; JP2010-114810 20100518
- International Application: PCT/JP2011/002492 WO 20110427
- International Announcement: WO2011/142097 WO 20111117
- Main IPC: H01L33/00
- IPC: H01L33/00
Abstract:
An object of the present invention is to provide a mounting substrate, a manufacturing method, a light-emitting module and an illumination device that can sufficiently improve the luminous efficiency of an LED lamp. A mounting substrate according to the present invention includes a substrate and a reflective film that is formed on a front surface of the substrate and has a front surface on which LED chips are to be mounted, and the reflective film is made of metal oxide microparticles and a glass frit, and reflects light from the LED chips.
Public/Granted literature
- US20120320601A1 MOUNTING SUBSTRATE AND MANUFACTURING METHOD THEREOF, LIGHT-EMITTING MODULE AND ILLUMINATION DEVICE Public/Granted day:2012-12-20
Information query
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